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Thapar Institute of Engineering and Technology Placements Details

Thapar Institute of Engineering and Technology Placements 2026, Top Companies & Package Details

Thapar Institute of Engineering & Technology (TIET), located in Patiala, Punjab, is an A++ NAAC-accredited deemed-to-be university. Established in 1956, TIET has earned a reputation for academic excellence and recruitment performance across India. The institute's recruitment process is driven by its specialized placement division, the Centre for Industrial Liaison and Placement (CILP), which connects graduating engineering, management, and science students with global technology firms, core industrial conglomerates, financial institutions, and research organizations.

Key Placement Highlights

The recruitment drives at TIET Patiala demonstrate strong corporate participation and competitive compensation packages across various streams:

  • Highest Salary Package: In the 2024 recruitment season, the highest salary package offered reached INR 1.23 Crore (1.23 CR) per annum, secured by a student in the Bachelor of Technology (B.Tech) Computer Science & Engineering stream. During ongoing drives for 2025–2026, top domestic offers have ranged between INR 24.81 LPA and INR 60.00 LPA.
  • Average Salary Package: The overall average salary package across all undergraduate programs stands at INR 11.38 LPA for 2025, with core computer science branches recording significantly higher averages of INR 16.50 LPA.
  • Placement Volume & Offers: During recent recruitment cycles, over 350 to 500+ top-tier companies participated in campus drives, generating 1,884+ total job offers and placing over 1,800 students across various undergraduate and postgraduate programs.
  • International Placements: International organizations and software firms extended around 75 international offers to TIET students, predominantly in software engineering, data analytics, and core systems research roles.
  • Management & MBA Placements: The LM Thapar School of Management (LMTSM) recorded a highest salary package of INR 24.81 LPA, with the top 10% of the MBA graduating batch securing an average compensation of INR 12.64 LPA.

Branch-wise & Program-wise Placement Breakdown

The table below outlines the branch-wise and program-wise placement performance, average CTCs, and highest CTCs recorded at TIET Patiala:

Degree / Stream

Students Placed (2025 Batch)

Average Package (in INR)

Highest Package (in INR)

Primary Recruiting Domain

B.Tech Computer Science & Engg. (CSE)

285

INR 16.50 LPA

INR 1.23 CR

Software Engineering, Cloud, AI/ML

B.Tech Electronics & Comm. Engg. (ECE)

210

INR 12.80 LPA

INR 42.00 LPA

Embedded Systems, VLSI, Telecom

B.Tech Mechanical Engineering

145

INR 9.50 LPA

INR 28.50 LPA

Core Manufacturing, Automotive, R&D

M.Tech (Various Engineering Disciplines)

120

INR 10.20 LPA

INR 35.00 LPA

Advanced R&D, Design, Data Systems

Master of Computer Applications (MCA)

85

INR 9.75 LPA

INR 22.00 LPA

Full-Stack Dev, IT Consulting

MBA (LM Thapar School of Management)

151

INR 9.87 LPA (Top 50%)

INR 24.81 LPA

Consulting, BFSI, Marketing & Ops

BBA & Undergraduate Business Streams

45

INR 6.80 LPA

INR 12.00 LPA

Analytics, Sales & BD, Operations

B.Sc / B.Com / Humanities

30

INR 5.50 LPA

INR 9.50 LPA

Business Analysis, Research, EdTech

Year-wise Placement Trends

TIET has sustained steady growth in average packages and total corporate recruiters over recent years:

Placement Year

Total Registered Students

Students Placed

Placement Rate

Average Package (in INR)

Overall Highest Package (in INR)

2025 (Ongoing)

2,000

1,884

83.00% (so far)

INR 11.38 LPA

In Process (Ongoing)

2024

2,000

1,774

88.87%

INR 11.25 LPA

INR 1.23 CR

2023

2,100

1,664

79.20%

INR 11.73 LPA

INR 55.75 LPA

2022

1,960

1,500

76.50%

INR 10.38 LPA

INR 40.00 LPA

2021

1,750

1,300

74.00%

INR 9.14 LPA

INR 43.31 LPA

Centre for Industrial Liaison and Placement (CILP) Activities

The Centre for Industrial Liaison and Placement (CILP) functions as the dedicated administrative node responsible for bridging academic learning with corporate expectations. Key operational activities managed by CILP include:

Pre-Placement Skill Development

CILP conducts structured preparatory modules for students starting in their third year of study. These modules cover quantitative aptitude, logical reasoning, verbal ability, competitive programming, dynamic system design, and domain-specific core subjects.

Mock Assessment & Technical Interview Prep

To prepare candidates for competitive recruitment processes, the placement cell organizes mock group discussions, online coding tests, technical interviews, and HR assessment rounds. These sessions are facilitated by experienced industry experts and alumni.

Corporate Immersion & Leadership Talks

CILP hosts regular corporate guest lectures, CEO seminars, technical hackathons, and industry interaction sessions. Companies like Microsoft, Amazon, and Deloitte frequently collaborate with CILP to organize specialized coding challenges and project competitions.

Internship Ecosystem & Practical Training

Internships at TIET are designed as an integral structural component of the academic curriculum:

  • Six-Month Project Work (Capstone Internship): Final-year undergraduate engineering students complete a mandatory semester-long project work or industrial internship in major corporate firms or research organizations.
  • Pre-Placement Offers (PPOs): Students performing well during their six-month industrial training modules frequently receive direct Pre-Placement Offers (PPOs) prior to their final semester graduation. In recent drives, over 17+ PPOs were extended in the management stream alone, alongside numerous tech PPOs.
  • Summer Internships: Second-year and third-year students secure paid summer internships across IT, product development, finance, and core manufacturing industries.
  • International Research Internships: Selected top-performing students participate in summer research internships at foreign academic partner institutions, including Trinity College Dublin (TCD) and other European universities.

Top Recruiters Across Major Sectors

TIET attracts recruiters across multiple industrial sectors, including software, product development, core engineering, management consulting, and finance:

  • Information Technology & Software Product: Microsoft, Amazon, Google, Adobe, Apple, Cisco Systems, Airbnb, Cloudera, Arcesium, DE Shaw, Intuit, Nutanix, Salesforce.
  • Banking, Financial Services & Insurance (BFSI): JP Morgan Chase, BlackRock, American Express, HSBC, Barclays, Morgan Stanley, Goldman Sachs.
  • Consulting & Professional Services: Deloitte, Accenture, PwC, EY, KPMG, Capgemini, Incedo, Zs Associates.
  • Core Engineering & Automotive: L&T, Tata Motors, Hero MotoCorp, Honda, Bosch, Siemens, Mahindra & Mahindra, Anand Automotive, Engineers India Ltd.
  • Electronics, Semiconductors & Hardware: Intel, AMD, STMicroelectronics, Qualcomm, Nvidia, Texas Instruments.

Frequently Asked Questions (FAQs)

1. What was the highest package offered at TIET Patiala in recent placement drives?

The highest overall package recorded at TIET Patiala reached INR 1.23 Crore (1.23 CR) per annum, offered to a B.Tech Computer Science Engineering graduate.

2. What is the average package for Computer Science & Engineering (CSE) at TIET?

The average package for B.Tech Computer Science and Engineering (CSE) at TIET Patiala stands at approximately INR 16.50 LPA, which is higher than the institute-wide average of INR 11.38 LPA.

3. How does the Centre for Industrial Liaison and Placement (CILP) assist students?

CILP organizes campus recruitment drives, skill training workshops, mock technical and HR interviews, aptitude tests, guest lectures, and industry-sponsored hackathons to prepare students for corporate selection processes.

4. Is a semester-long industrial internship compulsory for TIET engineering students?

Yes. Engineering students at TIET undergo a mandatory 6-month industrial internship or project work module during their final year, which frequently leads to Pre-Placement Offers (PPOs) from top companies.

5. Which major companies visit TIET Patiala for core engineering branches like Mechanical and Civil?

Core engineering students are recruited by companies such as Larsen & Toubro (L&T), Tata Motors, Hero MotoCorp, Bosch, Swaraj Engines, Siemens, Engineers India Ltd., and Anand Automotive.

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